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Mobile Phone Computer Router Auto BGA Rework Station 5300W Chip Repairing Machine

Mobile Phone Computer Router Auto BGA Rework Station 5300W Chip Repairing Machine

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Description

Basic Info.
Model NO. WDS620
Mount Precision +-0.01mm
Alignment System Optical Prism+HD Camera
Work Mode Auto / Semi-Auto / Manual Optional
PCB Size Max 410*380mm
Power 5300W
N.W. 60kg
Transport Package Wooden Package
Specification L650*W630*H850mm
Trademark OEM
Origin Shenzhen, China
HS Code 8515809090
Production Capacity 500 Units / Month
Product Description

Mobile Phone Computer Router Auto BGA Rework Station 5300W Chip Repairing Machine


Mobile Phone Computer Router Auto BGA Rework Station 5300W Chip Repairing Machine


Mobile Phone Computer Router Auto BGA Rework Station 5300W Chip Repairing Machine


Mobile Phone Computer Router Auto BGA Rework Station 5300W Chip Repairing Machine

Mobile Phone Computer Router Auto BGA Rework Station 5300W Chip Repairing Machine


bga rework station
mobile repairing machine
mobile phone BGA chipset rework station
tablet pc chipset rework station
router rework station
laptop notebook BGA chipset repairing system
smart phone chipset BGA repair soldering system
BGA repair soldering machine
BGA chipset welding machine
BGA repairing station
BGA de-soldering station
BGA Rework station
Suitable for all kinds of BGA repairing (CCGA,BGA,QFN, CSP,LGA,Micro SMD,MLF...)
WDS620 Technology parameter
Power supplyAC 220V±10% 50/60Hz
Total powerMax 5300W
Heater powerUpper temp.zone 1200W,second temp.zone 1200W,IR temp.zone 2700W
Electrical materialDriving motor+PLC smart temp.controller+HD camera
Temperature controlling(high precision K-sensor)(Closed Loop),independent temp.controller,the precision can reach ±1ºC
Locating wayV shape slot,PCB support jigs can adjust,laser light do fast centering and position
PCB sizeMax 410×370mm Min 10×10 mm
Applicable chipsMax 80×80mm Min 1×1 mm
Overall dimensionL650×W630×H850mm
Temperature Interface1 pcs
Weight of machine60KG
ColorWhite+blue

Independent 3 heating zones temperature control system
1. The upper and lower hot air heating,which can heat up at the same time from the top of he component to the bottom of the PCB;bottom IR heating,temperature precision control within ±1ºC.8 segment temperature control independently.
2. Hot air district heating for BGA and PCB at the same time,and large area IR heater preheating up for the bottom of PCB to avoid completely PCB deformation during reworking,the upper or lower temperature zones could be used alone and combine freely the energy of up and lower heating element.
3.Adopted high precision K-type thermocouple close-loop control and PID parameter self-setting system;4 temperature curves can be displayed with instant curve analysis function and multi-group user data can be saved;temperature can be tested precisely through external measurement interface,curves can be analysed,set and correct on the touch screen at any time.
Precision optical alignment system
Using high definition and adjustable CCD color optical alignment system,beam split,amplification,lessening,fine adjustment and auto focus with the function that automatic color aberration resolution and brightness adjustment,adjustable image contrast;equipped with 15 " high definition LCD monitor.
Multi-functional and humanized operation system
1.Adopting the HD touch human-machine interface;upper heating head and mounting head designed 2 in 1;providing many kinds of titanium alloy BGA tuyere can be rotated in 360 degree for easy installation and replacement.
2. X,Y and R angle adopted micrometer fine-tuning,accuracy locating,precision can reach ±0.01mm.
Superior safety protection function
With the alarm function, after the BGA welding the machine can alarm by itself.In the case of temperature abuse, the circuit can power off automatically with the double over-temperature protection.Temperature parameter having password protection to prevent any modification.

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