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4800W Manual BGA Rework Station BGA Repair Soldering Machine

4800W Manual BGA Rework Station BGA Repair Soldering Machine

Specifications Main Functions : 1. Embedded Industrial PC, high definition touch screen interface, PLC control, and inst
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Description

Basic Info.
Model NO. DHA1
Specification L800*W900*H950 mm
Trademark OEM
Origin Shenzhen, China
HS Code 8515809090
Production Capacity 500 Units / Month
Product Description

4800W Manual BGA Rework Station BGA Repair Soldering Machine


4800W Manual BGA Rework Station BGA Repair Soldering Machine


4800W Manual BGA Rework Station BGA Repair Soldering Machine


4800W Manual BGA Rework Station BGA Repair Soldering Machine


4800W Manual BGA Rework Station BGA Repair Soldering Machine



Specifications
Total Power4800W
Top heater800W
Bottom heater2 nd heater 1200W,3 rd IR heater 2700W(Increased larger the heating area to adapt to all types of P board)
powerAC220V±10%( or AC110V) 50/60Hz
DimensionsL800×W900×H950 mm
PositioningV-groove, PCB support can be adjusted in any direction with exernal universal fixture
Temperature controlK Sensor, Closed loop
Temp accuracy±2ºC
PCB sizeMax 500×400 mm Min 22×22 mm
BGA chip2X2-80X80mm
Minimum chip spacing0.15mm
External Temperature Sensor1 sensor,can expand(optional)
Net weight45kg

Main Functions :
1. Embedded Industrial PC, high definition touch screen interface, PLC control, and instant profile analysis function. Real-time settings and actual temperature profile display can be used to analyzed and correct parameters if necessary.
2. It uses precise K-type close circuit control and automatic temperature adjustment system, with PLC and temperature module to enable precision temperature control of ±2 deg C. External temperature sensor enables temperature monitoring and accurate analysis of real time temperature profile.
3. V-groove PCB support for rapid, convenience and accurate positioning that fits for all kinds of PCB board.
4. Flexible and convenient removable fixture on the PCB board which protectsand prevent damage to PCB. It can also adapt to rework various BGA packages.
5. Various sizes of BGA nozzles, which can be adjusted 360 degree for easy installation and replacement;
6. Three temperature areas can independently heat and are multiple controllable and adjustable to ensure best integration of different temperature areas. Heating temperature, time, angle, cooling and vacuuming can all be set on the interface.
7. There are 6-8 levels of variable and constant temperature controls. Massive storage of temperature curves which are Instant accessible according to different BGA. Curve analysis, setting and adjustment are all accessible via touch screen. Three heating areas adopts independent PID calculation to control heating process to enable more accurate and precise temperature control.
8. It uses high powered blower to enable fast cooling of PCB board and prevent it from deformation. There are also internal vacuum pump and external vacuum pen to assist with fetching the BGA chip.
9. Including Voice "early warning" function. 5-10 seconds before the completion of uninstalling or welding, voice reminder / warning to get the workers prepared. Cooling system will start after vertical wind stopped heating. When the temperature drops to room temperature, the cooling process will stop, so that the machine will not age after heated up.
10. CE certification, with emergency switch and automatic power-off protection device when emergency happens.

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